The technical introduction to the third edition -- Ultrasonic bonding systems and technologies, including a description of the ultrsonic wire bonding mechanism -- Bonding wire metallurgy and characteristics that can affect bonding, reliability, or testing -- Wire bond testing -- Gold-Aluminum intermetallic compounds and other metallic interface reactions in wire bonding -- Introduction to plating, setion A (gold) and section B (nickel-based) bond pad technology and reliability -- Cleaning to improve bondability and reliability -- Mechanical problems in wire bonding -- Advanced and specialized wire bonding technologies -- An overview of the materials and material science of copper, low-k devices that affect bonding and packaging -- Wire bonding process modeling and simulation.