Ch. 1. Regulatory and voluntary drivers for environmental improvement : hazardous substances, life-cycle design, and end of life -- ch. 2. Lead-free surface mounth technology -- ch. 3. Lead-free wave soldering -- ch. 4. Lead-free rework -- ch. 5. Lead-free alloys for BGA/CSP components -- ch. 6. Growth mechanisms and mitigation strategies of tin whisker growth -- ch. 7. Testability of lead-free printed circuit assemblies -- ch. 8. Board-level solder joint reliability of high-performance computers under mechanical loading -- ch. 9. Lead-free reliability in aerospace/military environments -- ch. 10. Lead-free reliability in automotive environments.