Wire bonding in microelectronics

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Title:

Wire bonding in microelectronics

Author:

Harman, George G.

ISBN:

9780071476232

9780071703345

9780071701013

Personal Author:

Harman, George G.

Edition:

3rd ed.

Publication Information:

Physical Description:

xx, 426 pages : illustrations ; 24 cm + 1 CD-ROM (4 3/4 in.)

General Note:

Revised edition of: Reliability and yield problems of wire bonding in microelectronics. 1989.

CD includes all the book's full-color figures plus animations.

Contents:

The technical introduction to the third edition -- Ultrasonic bonding systems and technologies, including a description of the ultrsonic wire bonding mechanism -- Bonding wire metallurgy and characteristics that can affect bonding, reliability, or testing -- Wire bond testing -- Gold-Aluminum intermetallic compounds and other metallic interface reactions in wire bonding -- Introduction to plating, setion A (gold) and section B (nickel-based) bond pad technology and reliability -- Cleaning to improve bondability and reliability -- Mechanical problems in wire bonding -- Advanced and specialized wire bonding technologies -- An overview of the materials and material science of copper, low-k devices that affect bonding and packaging -- Wire bonding process modeling and simulation.

Subject Term:

Wire bonding (Electronic packaging) -- Production control.

Electronic packaging -- Reliability.

Electronic packaging -- Defects.

Semiconductors -- Failures.

Added Author:

Harman, George G. Reliability and yield problems of wire bonding in microelectronics.

Copies:

Available:*

Library	Material Type	Item Barcode	Shelf Number	Copy	Status
Searching... 1:IIEMSA	1:GEN-BOOK	33168025788197	621.381 H254W 2010	1	Searching... Unknown

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Summary

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
The Industry Standard Guide to Wire Bonding--Fully Updated

The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics , Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.

COVERAGE INCLUDES:

Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation

CD includes all of the book's full-color figures plus animations.