Cover image for Fundamentals of lead-free solder interconnect technology : from microstructures to reliability
Title:
Fundamentals of lead-free solder interconnect technology : from microstructures to reliability
Author:
Lee, Tae-Kyu, author.
ISBN:
9781461492658
Personal Author:
Physical Description:
xiii, 253 pages : illustrations (some color) ; 24 cm
Copies: