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00IIE

Cover image for Wire bonding in microelectronics

Wire bonding in microelectronics

by

Harman, George G.

Format:

Electronic Resources

Publication Date

2010

Excerpt:

Wire bonding (Electronic packaging) -- Production control.

Available: Copies:

Cover image for Operations management : strategy and analysis

Operations management : strategy and analysis

by

Krajewski, Lee J.

Table of contents http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&doc_number=009732481&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA
Table of contents http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009732481&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA

Format:

Electronic Resources

Publication Date

2002

Excerpt:

Production management.

Available: Copies:

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