by
Callister, William D., Jr., 1940- author.
Format:
Books
Publication Date
2020
Excerpt:
of microstructure and alteration of mechanical properties -- Applications and processing of metal
by
Lee, Tae-Kyu, author.
Format:
Books
Publication Date
2015
Excerpt:
Fundamentals of lead-free solder interconnect technology : from microstructures to reliability /