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1. 
Cover image for Materials science and engineering : an introduction
Materials science and engineering : an introduction
by 
Callister, William D., Jr., 1940- author.
Format: 
Books
Publication Date 
2020
Excerpt: 
of microstructure and alteration of mechanical properties -- Applications and processing of metal
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2. 
Cover image for Fundamentals of lead-free solder interconnect technology : from microstructures to reliability
Fundamentals of lead-free solder interconnect technology : from microstructures to reliability
by 
Lee, Tae-Kyu, author.
Format: 
Books
Publication Date 
2015
Excerpt: 
Fundamentals of lead-free solder interconnect technology : from microstructures to reliability /
Available: Copies:
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